Semiconductors Industry

Equipment and automations for production and test of power semiconductor modules

  • From DBC Mastercard to the finished power module
  • Equipment and automatic lines for the production of power modules
  • Automatic handlers for test on wafers and power modules
  • Machines for cutting and soldering of Press-Fit Pins
  • AOI and 3D Laser for quality control

DBC MASTERCARD DIVIDER

  • Robotic handling
  • Touchless process
  • AOI for DBC integrity quality control
  • Traceability
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SOLDERING OF POWER LEADS ON DBC

  • Induction soldering
  • Cutting and automatic placement of Pins and Press-Fit Pins
  • Touchless process
  • AOI for checking the presence and height of the pins and Press-Fit Pins
  • Traceability
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ASSEMBLY – CASING

  • Glue dispensing
  • UV curing
  • Mono and bi-component silicone dispensing
  • Precision weighing
  • Traceability
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HANDLER FOR POWER MODULE TEST

  • Robotic handling
  • Static test - cold and hot
  • Insulation test
  • Dynamic test
  • Laser marking
  • AOI for quality control
  • Traceability
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HANDLER FOR WAFER TEST

  • Robotic handling
  • Machine vision for robot guidance
  • TRR diode automatic test
  • Wafer 5” and 6”
  • Traceability
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A qualified staff and high quality standards are at your disposal to develop innovative and customized solutions. Each request becomes a goal to achieve.